| 摘要 |
PROBLEM TO BE SOLVED: To improve the reliability of a PGA(ball grid array) package when the package is mounted on a connecting wiring board with solder, by improving the heat characteristic (heat radiating property) and electrical characteristic of the PGA package and, in addition, dispersing heat. SOLUTION: In a semiconductor device, heat conductor layers 209 are respectively provided at the connecting section between a wiring board and an integrated circuit chip 203 and its periphery on one surface of the wiring board and on the other surface of the wiring board opposite to the surface connected to the chip 203 within such extents that the layers 209 have no electrical contact. The layers 209 are stuck to the wiring board with an epoxy- or siliconebased adhesive 205. It is preferable to mix silver in the adhesive 205 so as to improve the heat conductivity of the adhesive 205. When a higher heat radiating property and a higher electrical characteristic are required, the thicknesses of the heat conductor layers 209 are increased. Therefore, the heat property, electrical characteristic, and reliability of the semiconductor device are improved. |
