| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a high quality printed wiring board and multilayered printed wiring board at good yield and at low cost. SOLUTION: In this method, a plurality of positioning projections 2 are provided in a wiring pattern non-formation region of a conductive foiled substrate 1, an etching resist layer 3 is formed on the surface forming with the projections 2. Next a wiring pattern mask 4 is placed on the etching resist layer 3, the positioning projections 2 and associated positioning parts 4a of the mask 4 are recognized optically for conducting positioning. The layer 3 is selectively exposed to light via the mask 4 to form a developed resist pattern 3', and an exposed conductive foil 1a is etched and removed for conducting wiring patterning. |
