SUBSTRATE TREATING DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the power consumption of a substrate treating device by reducing the size of the device. SOLUTION: A hot plate 20 of a heat-treating section 8 is constituted by successively laminating an auxiliary heating and cooling section 31 composed of a Peltier element, an intermediate plate 32, a heater section 33, and a heat radiating plate 34 upon a substrate supporting plate 30. A main controller 13 changes the heat-treating temperature of the heat-treating section 8 by controlling the auxiliary heating and cooling section 31 and heater 33 in accordance with a set treating condition.