| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of resin sealing wherein sufficient filling to corners is enabled in order that air may not generate residual voids in a portion which is hard to be filled with sealing resin, such as the part below wires bonded with high density, and filling is enabled without damaging the wires, so that sealing is enabled in the state that flatness of the sealing resin surface, its dimensional precision, etc., are sufficient. SOLUTION: In this method, sealing is performed by primary stencil printing wherein sealing part 8 is filled with sealing resin 10, from a resin pushing-in aperture 7 of a stencil plate 6, reciprocating a squeegee 9 in a vacuum atmosphere. After that, differential pressure filling is performed in a vacuum atmosphere lower than the above-mentioned vacuum atmosphere. As a result, the lower portions A1, A2, etc., of wires 5 bonded with high density to wiring leads 3 of a board 1 and bumps 4 of an electronic component 2 are sufficiently filled to corners with sealing resin 10. Complementary sealing is performed by secondary stencil printing in the same vacuum atmosphere.
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