| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which can realize lead connection in ordinary assembling steps without using wire bonding and with a secured reliability, and a method for manufacturing the semiconductor device. SOLUTION: Sequentially formed on a plurality of input/output pads 102 arranged in a predetermined pattern on an integrated circuit die 100 are a contact post 130 and a contact pad 132. A second lead frame is provided which has a plurality of lead fingers 150 at their tip ends having contact points arranged in a predetermined pattern. The contact points of the lead fingers 150 are connected to the contact pads 150.</p> |
