| 摘要 |
PROBLEM TO BE SOLVED: To provide such a positive chemically sensitizing photosensitive resin compsn. that a acid is produced in a pattern latent image forming part by irradiation of radiation such as UV rays, far UV rays, X-rays and electron beams according to a pattern, and that the produced acid is used as a catalyst for the reaction to make difference in the solubility in an alkali developer between in the irradiated part and in a non-irradiated part so as to develop the pattern, and to provide the positive chemically sensitizing photosensitive resin compsn. with high sensitivity and high resolution, and to provide a producing method of a resist image can develop a resist pattern with good resolution. SOLUTION: This resin compsn. contains (a) a resin soluble in an alkalieq. soln., (b) a compd. which produces an acid by irradiation of active chemical rays, and (c) a compd. having acid-decomposable group in the side chains which increase the solubility in an alkalieq. soln. by the acid catalyst reaction. The dissolving rate of the resin having solubility in an alkali aq. soln. in a 2.38 wt.% aq. soln. of tetramethylammonium is specified to 40 to 1000 nm/sec. The resist image is produced by irradiaing a coating film of the photosensitive resin compsn. with active chemical rays and then developing. |
