| 摘要 |
PROBLEM TO BE SOLVED: To prevent stage shift and wire deformation when a semiconductor is resin-sealed, by setting a specific surface area of a tablet formed by molding a molten resin composition, at a specified ratio or more. SOLUTION: A specific surface area of a tablet formed by molding a semiconductor sealing resin composition, containing a cresol novolac type epoxy resin and a phenol novolac type epoxy resin, etc., phenol compound provided with hydroxyl group in molecule as a compound of low coefficient of water absorption such as a phenol novolac resin, a cresol novolac resin and a naphthol novolac resin, etc., and inorganic filling materials such as amorphous silica, crystalline silica and calcium carbonate, etc., as essential ingredients, is set 2.5×10<-4> m<2> /g or more. Thereby, when a semiconductor is resin-sealed, stage shift and wire deformation are prevented, and a void is prevented from being generated.
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