| 摘要 |
PROBLEM TO BE SOLVED: To provide a device and method for inspecting the pattern defects of a semiconductor, in which the defect of a pattern can be operated in a short time for all the faces of a semiconductor wafer without deteriorating the detection precision. SOLUTION: A pellet 2a at a specific position on a semiconductor wafer 1 is selected as a reference pellet, and information related to the shape of a pattern Ps of the reference pellet 2s is fetched by using a CCD camera 12, and this is stored as a reference signal in an image information storage device 14. Also, the pattern shape of a pellet 2n to be inspected at an arbitrary position on the same semiconductor wafer 2 is fetched, and the fetched signal Pn is compared with the reference signal Ps by a comparator circuit 15, and the validity of the pattern is judged based on the error of the both. |
