| 摘要 |
PROBLEM TO BE SOLVED: To improve the adhesion strength between an insulation resin layer and conductor layer through plating by forming a circuit board and heat treating a wiring board at a temp. higher than the glass transition temp. SOLUTION: A method comprises the steps of roughening a Cu foil of a glass epoxy semiconductor board having a circuit pattern, laying and hot pressing epoxy resin prepregs on the front and back surfaces to form a hardened insulation resin layer, forming blind vias in the resin layer, roughening the surface of the resin layer and via hole inner walls, activating the roughened faces with a catalyst liq., electroless plating, electric Cu plating so as to form a conductor layer, laminating a photosensitive dry film, exposing and developing through specified circuit pattern mask, etching the conductor layer to form a circuit pattern. Thereafter, the resin layer is heat-treated at a temp. higher than the glass transition temp. |
