| 摘要 |
PROBLEM TO BE SOLVED: To mitigate variation of bonding pressure of a bump toward a pad on a substrate, and to prevent electric resistance from increasing in a condition where the volume of a filled-in bonding agent is varied, by pressing the bump with a pressure onto the substrate pad before the bonding agent is cured, and removing the pressure after the bonding agent is cured. SOLUTION: A bonding agent 39 is applied to an upper surface of a substrate 33 making use of a printing technique. A head 30 is heated by a heating element 301 in advance, up to a temperature sufficient for curing the bonding agent 39. Further, a bonding pressure of a bump 36 toward a pad 34 on the substrate 33 is set. Since the head 30 is suspended until the bonding agent 39 is completely cured, the bump 36 remains maintaining the bonding pressure toward the pad 34. After completing curing of the bonding agent 39 by heating, the pressure at a suction port 302 of the head 30 for pressurization and heating is changed into an atmospheric pressure so as to release a chip from being supported by vacuum suction, followed by elevation of the head 30. Thus, the bonding agent 39 is also released from being heated. |
