发明名称 SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR MODULE
摘要 PROBLEM TO BE SOLVED: To effectively prevent the parasitic oscillation, noise and crosstalk due to the element-element coupling by providing metal protrusions at specified period or less on the back of the cap. SOLUTION: Many conical protrusions 12 are formed on the cap back. A metal base plate 10 is made by etching an FeNiCo alloy, Kovar and its surface is plated with Ni/Au. The protrusion interval L meets L<c/2vε<1/2> where c is light velocity, E specific dielectric const. of a board, and v signal frequency. The protrusions 12 are made by die-casting an Al alloy and plate parts of them are adhered to the back of a cap plate 10 through a quickdrying Ag paste. A thin plate collecting the protrusions 12 is cut thin to 0.2 mm. The repetition frequency is less than a half the wavelength of a max. frequency signal.
申请公布号 JPH1140689(A) 申请公布日期 1999.02.12
申请号 JP19970207148 申请日期 1997.07.15
申请人 SUMITOMO ELECTRIC IND LTD 发明人 TATO NOBUYOSHI
分类号 H05K9/00;H01L23/02;H01L23/04;H01L23/66;(IPC1-7):H01L23/04 主分类号 H05K9/00
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