| 摘要 |
<p>PROBLEM TO BE SOLVED: To firmly adhere a chip having bumps on the bonding area of the conductor pattern part of a circuit board with less variation and high bonding strength. SOLUTION: This board is provided with a conductor pattern part 4 which has a pattern on a conductor layer 3 provided on a board main body 2, and two or more bondinq positions 6a, 6b and 6c where the bumps of a component to be mounted by ultrasonic bonding touch are set on the conductor pattern part 4. In this case, on the conductor layer close to at least one bonding position, a notched part 8a or a recessed part that extends from the edge of the conductor pattern part 4 to the inside, as far as an area close to the bonding position or a recessed part, is formed, or an isolated notched part 8b or a recessed part is formed.</p> |
