| 摘要 |
PROBLEM TO BE SOLVED: To provide a bump forming method and a bump bonder which can shorten one cycle operating time of bump formation and improve productivity. SOLUTION: This method consists of the following, a first process for forming a ball 5 at the tip part of a wire 4; a second process which makes a capillary 12 descend by opening a clamper, and makes a clamper descend by the moving amount smaller than the capillary 12 corresponding to the protruding; amount of the wire 4 tip from the lower end of the capillary 12 in the first process a third process for bonding the ball 5; and a fourth process which closes a clamper, makes the clamper and the capillary 12 ascend as far as the position in the first process, cuts and separates the wire 4 from the bump 21, and makes the wire 4 tip protrude from the lower end of the capillary 12. As a result, a process for leading out the tip of the wire 4 from the capillary 12 is omitted. |
