| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic wiring board which can form an accurate, fine, non-defect wiring pattern on and/or within a surface of the board. SOLUTION: Recesses 15 in the form of a conductive pattern are made in a positive photoresist layer 12 on a film base 11, a first green sheet 19 having via holes 20 is pressure-welded on the composite positive photoresist layer 12, having the recesses 15 filled with conductive paste 16 and dried and on a dried conductive paste layer 16' for transfer, conductive paste 21 is filled into the via holes 20 and dried, and another dried conductive paste layer 16' for transfer and another positive photoresist layer 12 are pressure-welded on the first green sheet 19, at which stage a ceramic wiring board is manufactured. |
