| 摘要 |
PROBLEM TO BE SOLVED: To prevent chip components from jumping out of container recessed parts having no cover tape because it is exfoliated, or the posture of the components has to be changed in the electronic component supply device, where the electronic component container tape placed on a reception guide is advanced corresponding to one arrangement interval of container recessed component, the cover tape is peeled off, and each chip component set in the container recessed part is supplied under a sucking pin. SOLUTION: This device is provided with a link board 42 that is pivotally supported by a fulcrum provided to a fulcrum board 40 fixed to a frame 1, a cover folder 44 that is pivotally supported by a fulcrum provided to the link 42, a cover 45 fixed to the cover folder 44, and a compression spring 46 placed between a spring seat provided to the upper end of the fulcrum board 40 and the cover folder 44. The cover 45 is pressed to a container recessed part of the electronic component container tape, from which the cover tape is peeled off and is made movable in matching with the fall of an adsorbing pin of the device. |
