发明名称 LEAD FRAME MEMBER SUPERIOR IN PLATING ADHESION
摘要 PROBLEM TO BE SOLVED: To avoid peeling a Pb or Pd alloy plating at outer lead bends, by using lead frame members made from an Fe-Ni material having specified crystal grain size or less. SOLUTION: Lead frame members having a high plating adhesion are formed from an Ni material contg. Fe 30-50 wt.%, the crystal grain size of the frame member is reduced below 40μm enough to avoid or lessen the orange peel at outer lead bends, thus obtaining lead frame members having little peel of plating layers and high plating adhesion. Use of the Pd plating or Pd alloy plating eliminates the possibility of the migration, thereby obtaining Pd plated lead frame members having a high corrosion resistance and high plating adhesion.
申请公布号 JPH1140727(A) 申请公布日期 1999.02.12
申请号 JP19970191597 申请日期 1997.07.16
申请人 DAIDO STEEL CO LTD 发明人 YAMADA HIROSHI;NAKANO KYOICHI
分类号 C22C38/00;C22C38/08;H01L23/50;(IPC1-7):H01L23/50 主分类号 C22C38/00
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