发明名称 PRODUCTION OF RELIEF PATTERN
摘要 PROBLEM TO BE SOLVED: To make it possible to form uniform relief patterns to a large area with high accuracy by forming a photosensitive resin layer on a substrate having a surface region where surface roughness is within a specific range and exposing and developing this layer. SOLUTION: A photosensitive film having a base film and the photosensitive resin layer of 100 to 300μm is thickness is honded onto a substrate having the surface region of 3 to 50μm in Rz (ten point average roughness) by directing the photosensitive resin layer surface toward the substrate surface and is then exposed and developed, by which the relief patterns are formed on the substrate. The substrate having the surface region of 3 to 50μm in Rz is a substrate for a rear surface plate of a plasma. display panel provided with electrodes of 3 to 50μm height on a flat glass plate. The photosensitive film is obtd. by applying a soln. of a photosensitive resin compsn. on the base film (polyethylene terephthalate film) of 3 to 100μm thickness and drying the coating, thereby forming the photosensitive resin layer.
申请公布号 JPH1138605(A) 申请公布日期 1999.02.12
申请号 JP19970192415 申请日期 1997.07.17
申请人 HITACHI CHEM CO LTD 发明人 FUJITA EIJI;OTOMO SATOSHI;TANNO SEIKICHI;KAKUMARU HAJIME;KATSUYA YASUO
分类号 G03F7/004;C23F1/00;H01J9/02;(IPC1-7):G03F7/004 主分类号 G03F7/004
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