发明名称 ELECTRONIC COMPONENT RECOGNIZING EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To enable recognizing the attitude of an electronic component and the defect of a constituent component by installing a pressure sensor, wherein a plurality of pressure sensitive elements are arranged in a lattice-type, making an electronic component to be recognized abut against the pressure sensor, and enabling definition in coordinates the abutting location and the abutting pressure. SOLUTION: By means of a component supplying equipment, a ball grid array(BGA) 2 is supplied, and a head driving part 7 moves above the BGA 2. A nozzle 5 built in the head driving part 7 descends, sucks the BGA 2, and ascends. The head driving part 7 holding the BGA 2 moves above an electronic component recognizing equipment 15. The nozzle which holds the BGA 2 descends, makes the BGA 2 abut against a pressure sensor 16, and presses the BGA 2 until a voltage is outputted from a pressure-sensitive element 17. A controller 18 recognizes the position attitude and the defect of the BGA 2 with the voltage outputted from the pressure sensitive element 17. Hence, the attitude of an electronic component and the defect of a constituent component can be recognized.
申请公布号 JPH1141000(A) 申请公布日期 1999.02.12
申请号 JP19970195828 申请日期 1997.07.22
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 UCHIDA HIDEKI;IKETANI KEIJI
分类号 H05K13/08 主分类号 H05K13/08
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