| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can maintain a high reliability as a product without decreasing its productivity even under severe service conditions. SOLUTION: In a semiconductor device 11, a flexible setting resin 18 more flexible than a sealing resin 19 and insulating protective layers 17 is provided between ends 19a of the sealing resin 19 and the protective layers 17. Even when the device is used under a condition of a large temperature change, a stress caused by differences in linear thermal expansion coefficient between the sealing resin 19 and the setting resin 18 and between setting resin 18 and the protective layer 17 is small. Therefore, the stress generated between the resin 19 and the protective layer 17 can be lightened and thus peeling off of the sealing resin 19 can be prevented. In this case, it can be made unnecessary to use such a special material as hard to obtain and expensive as the material of the sealing resin 19. |
