发明名称 METHOD AND DEVICE FOR MOUNTING ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To accurately mount a large number of electronic components on a printed circuit board in a short time. SOLUTION: A control section 7 controls a suction controller 8 to allow a suction nozzle 5 to suck a component 14, controls a Z-axis controller 11 to elevate the component 14, controls an X-axis controller 9 and a Y-axis controller 10 to move the component 14. When the control section 7 controls a θ-axis controller 12 to turn the component 14 and receives information that the component 14 has reached a prescribed position range on a plane from the X-axis controller 9 and the Y-axis controller 10, and that the component 14 has reached a prescribed angular range from the θ-axis controller 12, the control section 7 has the component 14 dropped. The component 14 is moved until it reaches an accurate mount position by using the time, when the component 14 is being dropped and turned until it reaches an accurate mounting angle.
申请公布号 JPH1140992(A) 申请公布日期 1999.02.12
申请号 JP19970208355 申请日期 1997.07.18
申请人 YAMAGATA CASIO CO LTD 发明人 WATANABE MASATO
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
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