| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the occurrence of air fluctuation at an image pick-up region without supplying cooling air to the image pick-up region with the use of a pick-up means, by providing a heat intercepting member between a predetermined region including a recognition region of at least one of a first and a second pick-up means, and bonding tools. SOLUTION: An IC chip 6 having a set position is picked up by a chip pick-up camera 21 serving as a first pick-up means. Further, a tape camera 26 serving as a second pick-up means for picking up a carrier tape 1 is arranged. The chip pick-up camera 21 is provided with a first heat intercepting member 31 so as to cover a portion thereof which faces bonding tools 25a, 25b. More specifically, at least a recognition region picked up by the chip pick-up camera 21 and the bonding tools 25a, 25b, are, thereby, thermally intercepted from each other. The tape camera 26 is covered with a second heat intercepting member 33. Thereby, at least a recognition region picked up by the tape camera 26 and the bonding tools 25a, 25b are thermally intercepted from each other.</p> |
