| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a mounting method for fixedly mounting a work fitted with a bump and bounding it firmly to a board with bond containing fillers. SOLUTION: After application of bond 8 with fillers 9 mixed on a board 5, a work 1 fitted with a bump sucked by vacuum by a suction nozzle is mounted on a board 5. the bottom of the tail of the bump 2 is pointed with a taper face, accordingly, the tail 3 goes down while moving the filler 9 sideward, and lands an electrode 5, sticking in the solder part 7. Next, the bond 8 is heated and hardened, and besides the solder part 7 is fused and solidified. As a result, the bump 2 is soldered to the electrode 6, and also the work 1 fitted with a bump is bonded to the board 5.</p> |
