| 摘要 |
<p>This invention concerns a composite (100) useful as a pad for integrated circuits, comprising an elastomer layer (110) having a first side and a second side, a first adhesive layer (120) attached to the first side; a second adhesive layer (130) attached to the second side; wherein the first and second adhesive layers (120, 130) are made of a different material than the elastomer layer (110).</p> |
