APPARATUS FOR TREATING SEMICONDUCTOR WAFERS

摘要

Apparatus for the treatment of substrates (20), such as semiconductor wafers, with a flow of treatment fluid. A flow resistance barrier (24) is positioned in the treatment vessel (12) upstream of the flow of fluid across the wafers (20). The flow resistance barrier (24) is formed as a unitary member with a sealing member (26) that is positioned within the wafer treatment vessel housing walls. The flow resistance barrier provides for a substantially uniform flow of fluids over the wafers (20). The flow resistance barrier (24) is embedded within the sealing member (26), and the sealing member (26) is compressed within a cavity (28) within the vessel, such that collection of contaminants in the sealing member cavity (28) is avoided.