HEAT DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE,申请号JP19970189379-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	HEAT DISSIPATING STRUCTURE FOR ELECTRONIC DEVICE
摘要
申请公布号	JPH1140968(A)	申请公布日期	1999.02.12
申请号	JP19970189379	申请日期	1997.07.15
申请人	MATSUSHITA ELECTRIC IND CO LTD	发明人	ISHII MASAHIRO
分类号	H05K7/20;(IPC1-7):H05K7/20	主分类号	H05K7/20
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Method for improving the sidewall stoichiometry of thin film capacitors

Method for the binaural adjustment of hearing aids

Data transmission method and radio system

Process for the separation of a component from a gaseous medium and a device forcarrying out the process

Method and kit for extracting prion protein

Exhaust mixer and apparatus using same

Tamper-evident closure having improved drainage

Salicylaldoximes and method of preparation

Flexible water absorbent polymer coating

A method and an apparatus for feeding image plates used for intraoral dental x-ray photography into a reading device

APPARATUS WHICH IS ELECTRONICALLY SWITCHED ON AND OFF

TRANSMISSION SYSTEM

SIGNAL PROCESSING METHOD AND VIDEO/VOICE PROCESSING DEVICE

DEVICE FOR CLEANING

METHOD OF SEARCHING OR BROWSING MULTIMEDIA DATA AND DATA STRUCTURE

HINGE TYPE AUTOMATIC DOOR CLOSER

OPTICAL FIBER PREFORM HAVING OH BARRIER AND FABRICATION METHOD THEREOF

DEVICE AND METHOD FOR GENERATING SPREADING CODE AND SPREADING CHANNEL SIGNALS USING SPREADING CODE IN CDMA COMMUNICATION SYSTEM

PEM FUEL CELL AND METHOD FOR THE PRODUCTION THEREOF

A METHOD OF CONTROLLING FUNGAL PATHOGENS, AND AGENTS USEFUL FOR SAME