| 摘要 |
<p>PROBLEM TO BE SOLVED: To avoid flowing solder flow away via through-holes and to increase the solder zones of electrodes to lands, thereby surely soldering them by forming blinding in the through-holes and blocking them. SOLUTION: Through-holes 2 of about 0.2 mm diameter are formed in an insulation board 1, a first and a second conductive patterns 3, 4 for electric writings are formed on both sides thereof. Blindings 7 for blocking the through- holes 2 are provided in the through-holes 2 near the one side of the board 1 having lands 5, and electrodes 9 of electric components 8 are mounted on the lands 5 near the through-holes 2 and soldered to the lands 5, where the in-flow of solder 10 becomes smaller in the through-holes so as to increase the solder zones of the electrodes 9 to the lands 5, thus surely soldering them.</p> |
