SEALED TYPE BALL BONDING EQUIPMENT AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a ball bonding equipment and a method which can form ball bonding accurately and with consistency. SOLUTION: This equipment has a cavity 214 which is suitable for a capillary 200 to mold at least partially ball bond during a ball bonding operation period. The tip of a bonding wire passing through a capillary 200 molds a greater part of ball bond during the ball bonding operation period of the cavity 214, and ultrasonic welding is performed to the bonding surface. The applied bonding strength can be remarkably reduced or eliminated by the bonding equipment driving the capillary 200. The capillary 200 is positioned at a specified standoff (isolation) height relative to the bonding surface.