发明名称 THREE-DIMENSIONAL CIRCUIT DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a three-dimensional circuit device, which facilitates the connections between the connection lead terminals of electrical components, such as a relay, a switch, etc., and conductors molded in a molded component. SOLUTION: A three-dimensional circuit device 1 consists of a three- dimensional molded component 2, in which a plurality of conductors 3 are molded. Electrical components such as a relay, a switch, a terminal block, etc., can be attached to its surface and can be electrically connected to the conductors 3. Among the conductors 3, the conductors 3 which are to be connected to external circuits have outer connection terminals 4, which are made to protrude out of the three-dimensionally molded component 2. Female contacts 6 and 7 are formed integrally on the conductors 3 and connected to the connection parts of the electrical components so as to realize electrical connections.</p>
申请公布号 JPH1141754(A) 申请公布日期 1999.02.12
申请号 JP19970200808 申请日期 1997.07.10
申请人 MOLEX INC 发明人 KUNISHI SHINSUKE;YAMAGUCHI SHIGETOSHI
分类号 H05K1/18;H01R9/24;H02G3/16;H05K1/00;H05K1/02;H05K3/00;H05K3/20;(IPC1-7):H02G3/16 主分类号 H05K1/18
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