Multilayer substrate mfg method for PCB - involves correcting relative position offset of substrates by suitably shifting one substrate relatively and fixing other substrate after shifting is completed

摘要

The method involves forming mark at both ends of a pair of substrates (P1,P2) separated by the non-hardened cementing substrate (B). A pair of pick-up parts (C1,C2) is provided to pick-up the marks on both side ends of the two substrates, respectively. The position of each mark is searched by processing the corresponding image. The relative position offset of the substrate is corrected by suitably shifting one substrate relatively and fixing the other substrate after shifting is over. The two substrates are maintained using first and second holders (11,17), respectively. The ends of the two holders are supported by shifting parts (2,3) respectively.