Mounting and encapsulating a SAW device using a photosensitive resin

摘要

A surface acoustic wave (SAW) device 1 is mounted face down on, with its active surface facing towards, a substrate 6. Electrical connections are made via pads 4, 5 and 7. A photosensitive resin 8 is used to fill a peripheral gap between the SAW device and the substrate. The resin may absorb thermal stresses and other extraneous mechanical forces acting upon the pads. Thus the photosensitive resin reinforces the pad connection. A second resin may encapsulate whole device.