发明名称 |
Thermally conductive silicone composition |
摘要 |
A thermally conductive silicone composition which comprises (A) 5 to 30 weight % of a liquid silicone, (B) 50 to 94.98 weight % of at least one thickener selected from the group consisting of a zinc oxide powder, an aluminum powder, an aluminum nitride powder, a boron nitride powder and a silicon carbide powder, (C) 0.01 to 10 weight % of an organopolysiloxane having at least one per molecule of hydroxyl group attached directly to a silicon atom, and (D) 0.01 to 10 weight % of an alkoxysilane, thereby retainining satisfactory thermal conductive properties and hardly causing oil bleeding over a long time. <IMAGE> |
申请公布号 |
EP0896031(A2) |
申请公布日期 |
1999.02.10 |
申请号 |
EP19980306237 |
申请日期 |
1998.08.04 |
申请人 |
SHIN-ETSU CHEMICAL CO., LTD. |
发明人 |
YAMADA, KUNIHIRO;TAKAHASHI, TAKAYUKI;ISOBE, KENICHI |
分类号 |
C09K5/08;C08K3/00;C08K3/14;C08K3/22;C08K3/28;C08K3/34;C08K3/38;C08K5/5415;C08K5/5419;C08L83/04;C08L83/06;C10M169/02;C10N10/04;C10N10/06;C10N20/00;C10N20/02;C10N20/06;C10N30/00;C10N30/08;C10N40/14;C10N50/10 |
主分类号 |
C09K5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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