摘要 |
The current regulator module has at least two power semiconductor switches (36,38), e.g. GTO thyristors, in good thermal contact with the base plate (6) of a heat sink profile (2) having a number of spaced cooling ribs (8) on the opposite side of the base plate. The base plate has a reduced thickness at its end section (10), receiving a L-shaped circuit board holder (42) for a control stage. The heat sink profile is fitted with a cover (24), dividing the region above the base plate into two thermally separate zones, the part of the cover extending across the semiconductor switches provided with cooling ribs (26).
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申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
KOLK, WILFRIED, DIPL.-ING., 91334 HEMHOFEN, DE;SCHIFFER, FRANZ-PETER, DIPL.-ING.(FH), 91056 ERLANGEN, DE;FLOSKY, RAINER, DIPL.-PHYS., 90411 NUERNBERG, DE |