Hot melt adhesive applicator

摘要

A system usable for dispensing fluids including hot melt adhesives, supplied from a reservoir, onto a substrate. The system includes a plurality of fluid dispensing nozzles coupled to a fluid supply conduits disposed in a main manifold wherein fluid is supplied from a fluid metering device. An air preheater module is mountable to the nozzles and provides heated air for controlling the fluid dispensed by the nozzles. The main manifold includes a plurality of recirculation conduits each disposed between a fluid supply conduit and the fluid reservoir. A one-way valve disposed along each recirculation conduit conditionally recirculates fluid toward the fluid reservoir. A variety of recirculation manifold configurations are interchangeably mounted to the main manifold for recirculating fluid toward the fluid reservoir. Fluid pressure gauges monitor pressure in individual fluid supply conduits, or alternatively an average fluid pressure. The fluid metering device is mountable in a well in the main manifold, wherein a common heating member heats both the main manifold and the fluid metering device.