发明名称 RESIN SEALING MOLD AND RESIN SEALING METHOD USING SUCH MOLD
摘要 PROBLEM TO BE SOLVED: To simply set a resin sealing condition to each of cavities and to form the resin sealing part of a package free from appearance defect. SOLUTION: A resin sealing mold 1 is equipped with upper and lower molds 2, 3 forming a plurality of cavities, a resin supply part 5 provided to the upper mold 2 or the lower mold 3 to supply a resin into the cavities 4 and a runner part 6 consisting of the first runner parts 61 formed to the lower mold 3 between the resin supply part 5 and the cavities 4 and the second runner parts 62 formed to the upper mold 2. The first runner parts 61 communicate with the resin supply part 5 and the end parts 61a on the side of the second runner parts 62 are arranged at the almost intermediate positions of a plurality of the cavities 4 in a state opened on the side of the upper mold 2 and the second runner parts 62 reach a plurality of the cavities 4 from the end parts 62a on the side of the first runner part 61 and consist of a plurality of passages 62b formed at a mutually almost equal distance interval.
申请公布号 JPH1134114(A) 申请公布日期 1999.02.09
申请号 JP19970189351 申请日期 1997.07.15
申请人 OKI ELECTRIC IND CO LTD 发明人 MURAYAMA KOICHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/26 主分类号 B29C45/26
代理机构 代理人
主权项
地址