发明名称 Thermocouple for use in an apparatus for manufacturing a semiconductor device
摘要 A thermocouple for use in an apparatus for manufacturing a semiconductor device having two metal wires, each composed of a different material, being connected at one end. A first insulator extends a first length from the connected end of the metal wires and electrically insulates a portion of one of the metal wires. A second insulator, having a brittleness factor less than that of the first insulator, extends a second length from the first insulator along the same metal wire. The lifetime of the thermocouple can be lengthened and productivity of the semiconductor device can be enhanced.
申请公布号 US5868497(A) 申请公布日期 1999.02.09
申请号 US19960774607 申请日期 1996.12.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, DONG-OK
分类号 G01K7/02;F23N5/10;G01K7/04;H01L35/32;(IPC1-7):G01K7/02;H01L35/02 主分类号 G01K7/02
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