发明名称 Nozzle for soldering apparatus
摘要 A nozzle is able to reliably coat and solder a paste-like solder onto a joined member to be soldered, e.g., a plurality of surfaces of two surfaces or more including a joined corner of a metal plate and a base. In a nozzle (1A) according to the present invention, an inner wall length of a tip end portion (4) of a pipe forming a nozzle body (2) is selected such that one side portion (4A) side is reduced in length and an opposite portion (4B) side opposing the one side portion (4A) side is increased in length and an outlet (5) with a sunken opening (5A) is formed at the tip end portion (4) by progressively approaching an inner wall surface (4b) of the other side portion (4B) side to an inner wall surface (4a) of the one side portion (4A) side. Thus, a paste-like solder (S) to be escaped flows in an oblique direction different from the direction in which a fluid guided by the nozzle body (2) portion flows.
申请公布号 US5868324(A) 申请公布日期 1999.02.09
申请号 US19960754705 申请日期 1996.11.21
申请人 SONY CORPORATION 发明人 TSURUSAKI, ARATA
分类号 B05B1/02;B23K3/08;H05K3/34;(IPC1-7):B05B1/00 主分类号 B05B1/02
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