发明名称 LASER PROCESSING
摘要 <p>PROBLEM TO BE SOLVED: To form a slit on a resin layer and a metal layer, without damaging the resin layer of a sheet processing material laminated with the resin layer and the metal layer, by changing a laser beam irradiating position to a longitudinal direction of the processing part, while generating the laser beam in a pulse type. SOLUTION: The sheet processing material 10, which is to be finished in a probe unit 12, is irradiated with the laser beam at the processing part indicated by a broken line, from the metal layer side intermittently. The irradiating point of the processing part is repeatedly changed in succession gradually along the processing part. Thus, the processing part is cut in a shape shown by a cutting line 20, a notching part 22 are formed on the resin layer 14 and on the metal layer, and a grove 24 is formed on the metal layer. In this case, an impact to the neighboring of the processing part is remarkably minimized and the resin layer 14 is not damaged. Also, a slit with a narrow width and a larger depth size can be formed by fixing a focus point of the laser beam at a new processing face whenever the irradiating point is changed each time.</p>
申请公布号 JPH1133755(A) 申请公布日期 1999.02.09
申请号 JP19970210188 申请日期 1997.07.22
申请人 MICRONICS JAPAN CO LTD 发明人 TANABE ISAO;KIYOFUJI HIDEHIRO
分类号 B23K26/00;B23K26/08;H01S3/00;H01S3/16;H05K3/00;(IPC1-7):B23K26/00 主分类号 B23K26/00
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