摘要 |
<p>PURPOSE: To prevent occurrence of unevenness in heat resistance of a laminate by superposing a plurality of resin sheets obtained by impregnating a sheet base material with resin, drying it, and modifying it, then reduced pressure drying it and then heating and pressure molding it, thereby maintaining moisture amount in the resin sheet constant by the reduced pressure drying it. CONSTITUTION: In the case of manufacturing the laminate used for a printed circuit board, eight resin sheets 1 obtained by impregnating a sheet base material with phenol resin, drying it and modifying it are, for example, superposed, and a copper foil 2 coated with adhesive resin is superposed thereon. And, it is sandwiched between plates 3, set in a vacuum press, pressure-reduced to about 50 Torr of vacuum degree at about 45 deg.C in the state that applied pressure is not applied, reduced pressure dried for about 20 min, then heated, pressurized, laminated, and molded to obtain a one-side copper-clad laminate. Thus, the sheets 2 are reduced pressure dried to remove moisture absorbed to the sheets 1, and then heated and pressurized according to an ordinary method, laminated and molded to obtain the laminate having no unevenness in heat resistance.</p> |