发明名称 ADHESIVE TAPE FOR ELECTRONIC PARTS
摘要 PROBLEM TO BE SOLVED: To provide an adhesive tape which not only has satisfactory adhesiveness at a relatively low temperature, but also has secure insulation and is free from generation of a gas and from occurrence of interfacial separation, and thus has excellent electrical reliability, by laminating adhesive layers A and B comprising specific polyimide mixtures respectively, which are different from each other in composition and in glass transition temperature. SOLUTION: This tape is obtained by laminating a metal plate, an adhesive layer A and an adhesive layer B sequentially. As adhesive layer A, an adhesive having a glass transition temperature which is 40 deg.C or more higher than that of adhesive layer B is used. Adhesive layer A comprises 100 to 20 mole % of a structural unit represented by formula I (wherein, Ar is a divalent group having an aromatic group and represented by formula III or the like), and 0 to 80 mole % of a structural unit represented by formula II (wherein Ar is as defined for formula I). Adhesive layer B comprises 100 to 40 mole % of a structural unit represented by formula I, and 0 to 60 mole % of a structural unit represented by formula IV (wherein R is a 1-10C alkylene or -CH2 OC6 H4 - group which is bonded to Si at the methylene group; and (n) is 1 to 20). The thickness of the metal plate (for example, copper) is 10 to 300 μm.
申请公布号 JPH1135902(A) 申请公布日期 1999.02.09
申请号 JP19970212442 申请日期 1997.07.23
申请人 TOMOEGAWA PAPER CO LTD 发明人 OKA OSAMU;TOCHIHIRA JIYUN;KOMAGATA FUMITADA
分类号 B32B7/12;B32B15/08;C08G73/10;C09J7/02;C09J179/08;H01L21/52;H01L21/60;H01L23/495 主分类号 B32B7/12
代理机构 代理人
主权项
地址