| 摘要 |
PROBLEM TO BE SOLVED: To provide the soldering material and the electronic part using the soldering material which can improve thermal fatigue resistance when the electronic member and a substrate are joined together with the soldering material, and can decrease damages of a coating in an occasion that Ni coating is applied. SOLUTION: Composition of the soldering material is as follows: 0.01-4.99 weight% Fe, 0.01-4.99 weight% and its total sum is 0.02-5.0 weight% Ni, 0.1-8.0 weight% of at least one of Ag and In, 0-70 weight% Pb. The balance is Sn and unavoidable impurity. The electronic part is to be assembled by soldering a semiconductor device 5 and the substrate 8 using the soldering ball 7 consisting of the soldering material. |
