BONDING BY FILM ADHESIVE

摘要

PROBLEM TO BE SOLVED: To provide a bonding method by a film adhesive, capable of readily removing an adhesive which is made to overflow from the end face of bonding parts of parts to be bonded and cured without damaging the adhesive part and increasing dimensional accuracy of parts to be bonded thereby. SOLUTION: (A) A heat-resistant tape 11 which withstands melting temperature of an adhesive is attached to the end face of parts to be bonded so as not to bond the adhesive to the end face of the parts to be bonded at the previous stage of heat bonding and then, a slit 12 is applied to the heat-resistant tape along the bonding face to form a penetration ditch and (B) the adhesive is melted and cured by heating the bonding face in this state while pressurizing the bonding face and (C) the adhesive 5 which is made to overflow and cured is removed together with the tape. The heat-resistant tape may be an epoxy- based tacky tape having 100 μm-200 μm thickness.