| 摘要 |
Covered wires are overlapped with each other at an overlapping portion and pinched by a pair of resin chips. Cover portions are melted by ultrasonic vibration and conductive wire portions are conductively contacted with each other by pressing from outside of the resin chips. A pair of the resin chips are melt-fixed to seal the overlapping portion S. The resin chips have main melting portions which are melted with each other to pinch and seal the overlapping portion S, auxiliary melting portions which are melted with each other such that cover portions of covered wires introduced from the main melting portions are pinched and cover portion removing portions formed in the auxiliary melting portions to melt and extrude the cover portion. Thus, by this covered wire connection structure, it is possible to provide an excellent melting performance and achieve enhancement of melting force between the resin chips and improvement of covering performance for conductive wire portions.
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