| 摘要 |
PROBLEM TO BE SOLVED: To provide an IC card equipped with an IC module which can protect an IC chip appropriately against external pressure. SOLUTION: An IC card 10 consists of a card substrate 20 and an IC module 11 mounted in the recessed part 21 of the card substrate 20. The IC module 11 is equipped with a substrate 12, a terminal part 13 formed on a side of the substrate 12, and an IC chip 14 mounted on the other side of the substrate 12. The terminal part 13 and the IC chip 14 are connected by a wire 15, and the IC chip 14 and the wire 15 are covered with a resin sealing part 16. In the recessed part 21 of the card substrate 20, a filler 25 is arranged between the resin sealing part 16 and the card substrate 20. |
