| 摘要 |
PROBLEM TO BE SOLVED: To prevent bending or damage to an IC chip module by embedding a circuit in filling resin interposed between flat card base materials, and integrating the base material with the filling resin containing the circuit. SOLUTION: A terminal 18 of an antenna coil 7 is connected to an electrode terminal 16 of an IC chip module 3. And, the module 3 is stuck on a predetermined position of a card substrate 1 with adhesive using filling resin. Thereafter, another one card substrate 1c attached with filling resin 19 is disposed so that the resin 19 is located at the module 3 side. And, the substrates 1, 1c are heated and brought into pressure contact with one another from both surfaces. The resin 19 is cured, and the coil 7 and module 3 are assembled in the card substrate. |
