发明名称 RESIN MOLD DEVICE USING RELEASE FILM AND RESIN MOLDING METHOD
摘要 PROBLEM TO BE SOLVED: To prevent a release film supported by suction on a parting face from developing an irregular part such as crease. SOLUTION: In the resin mold device using a release film 10 which molds resin by clamping a product to be molded 12 through the release film 10 supported by suction on the parting face of a mold 20a (20b) for molding the resin, a sagging absorption groove 42 which absorbs a sagging by sucking the sagging part of the release film 10, through air suction, is formed in the parting face. The release film 10 is sucked by the sagging absorption groove 42 through air suction to absorb the sagging, and the product to be molded 12 is clamped to be molded with the resin.
申请公布号 JPH1134066(A) 申请公布日期 1999.02.09
申请号 JP19970191003 申请日期 1997.07.16
申请人 APIC YAMADA KK 发明人 MIYAJIMA FUMIO
分类号 B29C33/18;B29C33/68;B29C45/02;B29C45/14;B29C45/34;B29L31/34;H01L21/56;(IPC1-7):B29C33/18 主分类号 B29C33/18
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