发明名称 Semiconductor integrated circuit device and manufacturing method for the same
摘要 A semiconductor integrated circuit device having an SOI structure is capable of preventing occurrence of leak current flowing from a diffusion layer even when a semiconductor element having a pn-junction is included in the semiconductor substrate. The semiconductor integrated circuit device having the SOI structure is formed with a semiconductor layer, or SOI layer, on a p-type semiconductor substrate through a buried insulating film and further with semiconductor circuit elements serving as functional elements at the SOI layer thus formed. As a protection transistor to protect the semiconductor circuit elements, a MOSFET may be formed in which n-type diffusion layers are formed in the semiconductor substrate. The n-type diffusion layers of the MOSFET are to be surrounded by p-type diffusion layers more highly doped than the semiconductor substrate.
申请公布号 US5869872(A) 申请公布日期 1999.02.09
申请号 US19970974700 申请日期 1997.11.19
申请人 NIPPONDENSO CO., LTD. 发明人 ASAI, AKIYOSHI;SAKAKIBARA, JUN;SUZUKI, MEGUMI;FUJINO, SEIJI
分类号 H01L27/04;H01L21/265;H01L21/822;H01L21/8238;H01L27/02;H01L27/06;H01L27/092;H01L27/12;H01L29/786;(IPC1-7):H01L23/62;H01L27/76;H01L27/01 主分类号 H01L27/04
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