发明名称 |
Semiconductor inner lead bonding tool |
摘要 |
A lead bonding tool for bonding leads to respective semiconductor chip contacts. The bonding tool having a substantially flat bonding surface region with a depression therein. The depression allows the tool to grasp the lead during the bonding step and further facilitate the transmission of energy from the tool to the lead/contact interface to form the bond. Certain embodiments of the lead also have grooves and/or guides which are adapted to capture and better align the elongated lead sections with their respective chip contacts during the bonding step.
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申请公布号 |
US5868301(A) |
申请公布日期 |
1999.02.09 |
申请号 |
US19960630375 |
申请日期 |
1996.04.10 |
申请人 |
TESSERA, INC. |
发明人 |
DISTEFANO, THOMAS H.;CARSON, FLYNN |
分类号 |
B23K20/02;B23K20/10;H01L21/00;H01L21/607;(IPC1-7):H01L21/60 |
主分类号 |
B23K20/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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