| 发明名称 |
Heat sink and electromagnetic protection device for pcb |
| 摘要 |
The device includes a metal structure with high porosity which is applied on the back or sides of an electronic component. The structure does not come in contact with the conducting paths present on the pcb surface. A porosity gradient inside the structure facilitates the heat dissipation by convection. |
| 申请公布号 |
FR2766967(A1) |
申请公布日期 |
1999.02.05 |
| 申请号 |
FR19970009796 |
申请日期 |
1997.07.31 |
| 申请人 |
SOCIETE DE CONSEIL ET DE PROSPECTIVE SCIENTIFIQUE SCPS |
发明人 |
DONIAT DENIS;EVEN ROLAND;ROUGET ROBERT |
| 分类号 |
H01L25/065;H01L25/10;H05K7/20 |
主分类号 |
H01L25/065 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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