发明名称 POLYOXYMETHYLENE COMPOSITION
摘要 A polyoxymethylene composition which is improved in heat stability, i.e., inhibited particularly from forming mold deposit during molding and/or from discoloring during residence in a molding machine in a molten state, and is free from malfunction due to formic acid generating from the composition. The composition contains based on the polyoxymethylene (a) 0.01 to 3 wt.% of a sterically hindered phenol antioxidant, (b) 0.01 to 3 wt.% of a melamine/ formaldehyde polycondensate, (c) 0.001 to 0.5 wt.% of at least one metal compound selected from among oxides and carbonates of magnesium and calcium, and (d) 0.0001 to 0.05 wt.% of at least one boric acid compound selected from among orthoboric acid, metaboric acid, tetraboric acid and diboron trioxide.
申请公布号 WO9905217(A1) 申请公布日期 1999.02.04
申请号 WO1998JP03301 申请日期 1998.07.23
申请人 POLYPLASTICS CO., LTD.;SUGIYAMA, NORIYUKI 发明人 SUGIYAMA, NORIYUKI
分类号 C08K3/22;C08K3/26;C08K3/38;C08K5/10;C08K5/13;C08L59/00;C08L61/28 主分类号 C08K3/22
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