| 摘要 |
PROBLEM TO BE SOLVED: To easily set a user-desired process by reducing a device length and facilitate the change in the treatment process involved in specification change. SOLUTION: A first board treatment unit 200 for etching treatment, a second board treatment unit 200' for rinse dry and a double cleaning unit 300 are arranged around a board delivery unit 100, which delivers a board 600 to a periphery. A buffer unit, wherein a board 600 is placed temperately, is installed in the double cleaning unit 300. |
